Syllabus
MEMS Foundry processes, CMOS-MEMS Integration: Design and technology, Bonding & Packaging of MEMS, MEMS reliability, non-silicon MEMS, Interface electronics for sense and drive in microsystems, MEMS and circuit noise sources, Noise and Offset Cancellation Technique, testing and calibration approaches in integrated microsystems. MEMS Sensors and Actuators: Case Studies (Mechanical, Inertial, bio/chemical, Microfluidics, RF Applications.); Future Directions and developments (Integrated Nano- Electro-Mechanical Systems (NEMS), NEMS oscillators and sensors)
Text Books
Same as Reference
References
1. Microsystem Design, S. D. Senturia, 2005.
2. Advanced Micro and Nano systems, Baltes, Brand, Fedder, Hierold, Kowenk, Tabata, Vol. 1, Enabling Technology for MEMS and Nano devices, Wiley-VCH, 2004.
3. Analysis and Design of Analog Integrated Circuits Gray, Hurst, Lewis, & Meyer, 4th edition, Wiley, 2004.
4. Fundamentals of Microfabrication Science of Miniaturization, Marc Madau, CRC Press.
5. Micro and Smart Systems Technology and Modeling , G. K. Ananthasuresh, K. J. Vinoy, S. Gopala Krishnan, K. N. Bhat , V. K. Aatre, 2012.
6. Peer reviewed international journals such as IEEE/ASME Journal of MEMS, IOP Journal of Micromechanics and Micro engineering, IOP Journal of Nanotechnology, Elsevier Sensors and Actuators etc. and conference proceedings such as IEEE MEMS, IEEE Nanotechnology, Transducers etc.