Course
PostgraduateSemester
ElectivesSubject Code
AVR863Subject Title
RF Packaging and Electromagnetic CompatibilitySyllabus
EMC Requirements for Electronic Systems: Sources of EMI; Aspects of EMC; Radiated susceptibility; Conducted susceptibility; Electrostatic discharge; Design constraints for products; Advantages of EMC design; Transmission line per-unit-length parameters: Wire type structures, PCB structures; High-speed digital interconnects and signal integrity. Non-ideal Behavior of Components: Spurious effects of wires, PCB, component leads, resistors, capacitors, inductors, ferromagnetic materials, electromagnetic devices, MMIC components, digital circuit devices, and mechanical switches. Conducted and Radiated Emissions: Measurement of conducted emissions; Power supply filters; Power supply and its placement; Conducted susceptibility; Simple emission models for wires and PCB leads; Simple radiated susceptibility models for wires and PCB leads. Crosstalk: Three-conductor transmission lines, shielded wires, twisted wires, shielding. System Design for EMC: Safety ground; PCB design; System configuration and design.
Text Books
Same as Reference
References
1. Introduction to Electromagnetic Compatibility, Paul, C.R., Wiley Interscience, 2006.
2. Electromagnetic Compatibility Handbook, Kaiser, K.L., CRC Press.
3. Engineering Electromagnetic Compatibility: Principles, Measurement and Technologies, Kodali, V.P., IEEE Press.
Course Outcomes (COs):
CO1: Analyze the different types of EMC standards and their requirements.
CO2: Design EMC compliant circuits for PCBs and the analysis of nonideal behaviour of various circuit elements.
CO3: Measurement of Conducted Emission, Radiated Emission, Conducted Immunity and Radiated Immunity in a test setup.
CO4: Analyze the methods of grounding and cabling.
CO5: Understand the PCB system design and configuration