Course
PostgraduateSemester
ElectivesSubject Code
AVM878Subject Title
Photonic Integrated CircuitsSyllabus
Electronic integrated circuits, Scaling of electronic devices, Electrical interconnects, issues with electrical interconnection, Optical interconnects-advantages-similarities with electrical interconnects Integration-Photonic Integrated Circuits (PIC)-brief history of PIC-Features- Materials for PIC platform-Si, Silica, SOI, III-V, LiNbO3 Basic theory of Planar and channel waveguide-effective index method-guided modes Types of waveguides-Optical losses in waveguides-(side wall scattering, bending, losses due to metal layer)-waveguide fabrication (LiNbO3 and III-V based)
Passive devices for photonic integrated circuits -waveguides-splitters-directional coupler- waveguide bends-coupled and uncoupled waveguides-application to directional coupler-gratings, DBR mirrors, Photonic crystals Switches and modulators for photonic integrated circuits - controlling guided waves-electro-optic effect, electro absorption effect, Quantum Confined Stark Effect (QCSE), -acousto-optic effect, – thermo-optic effect, -magneto-optic effect, plasma- dispersion effect, non-linear optic effect.
Phase modulators, intensity modulators, microring resonators, fabrication techniques, materials (Si, glass, polymer, III-V), multi-layer processing, all-optical switching, filters, transverse modulators, optical switches, self-electro optic devices (SEED)
Light sources and detectors for photonic integrated circuits: Edge emitting lasers, vertical cavity surface emitting lasers (VCSEL), advantages of VCSEL for interconnects, basic design. plasmonic lasers, single photon lasers, Resonant cavity enhanced photo detectors, pin photodetector, MSM photo detector
Silicon photonics: advantages and disadvantages of Silicon for photonics-Fabrication of Siwaveguide devices-SIMOX-BESOI-Wafer splitting-SOI-submicron waveguides, Silicon lightsources (LED, LASER), porous Silicon, Si nanocrystals, Raman effect based Si devices SiGedevices, QCSE effect in SiGe, SiGe modulator.
PIC configuration: Examples of III-V based PIC, Si based PIC, III-V on Si based PIC, OPTO- VLSI, chip-chip, board-board interconnect architecture, bi-directional interconnects, selected configurations from recent literature, free space interconnection.
Text Books
Same as Reference
References
1. Optical integrated circuits, Nishihara, Hiroshi, Masamitsu Haruna, and Toshiaki Suhara. McGraw Hill Professional, 1989
2. Diode Lasers and Photonic Integrated Circuits, Larry A. Coldren and Scott W. Corzine. Wiley.
Course Outcomes (COs):
CO1: Familiarization of the fundamental differences between electrical and optical interconnection, limitations of electrical interconnects, advantages of optical interconnects, To develop proficiency in understanding light propagation in optical interconnects [fibers, waveguides], loss mechanisms and modal analysis in optical waveguides
CO2: Designing various passive optical fiber components used in optical interconnects. And understanding the construction, operating principle and their features.
CO3: Learning the construction, operating principle, types and features of various optoelectronic devices [Sources, modulators/switches, amplifiers, detectors] that are used in optical interconnects.
CO4: Familiarization of design principles used in various photonic integrated circuits configurations [III-V based, Si based, III-V on Si based]