Pslv-In-orbitaL Obc and Thermals (PILOT), is a payload designed for the fourth (and final) stage of PSLV with the aim to achieve thermal model validation and flight qualifications for the in-house developed On-board computer, which is expected to fly in multiple upcoming missions developed at SSPACE. The payload carries a number of temperature sensors which are used to collect valuable thermal data for thermal model validation of various subsystems in LEO. The PILOT payload has a volume of ~1U, and a mass of less than 1kg. The bus is designed to work on less than 0.5W power. The power and telemetry of the payload is through PSLV stage 4. The payload has been succesfully launched in PSLV C55 on April 2023.

PILOT is an unique mission from IIST

• where an industry is begin partnered in the early stages of the development. The L&T is developing the the Structures for the PILOT using additive manufacturing.
• 3D printed structures will be flown in space for the first time